FEATURE Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 and 1206 size, with best EMI suppression effect but least impact to data signal wave form.
APPLICATIONS Preventive measureagainst high speed signal radiation emissions such as USB 2.0, IEEE1394 or LAN interface. Best for NB, DSC, mobile device design.
KING CORE ELECTRONICS INC. No. 269, Nanfeng Rd., , Pingjhen City, Taoyuan County, Taiwan