年程科技股份有限公司


积层式晶片磁珠

Multilayer Chip Beads


High density packaging with a pitch of 2.54mm(0.1inch)max. Is possible. This series requires less space and has greater EMI suppression effects.
Excellent in phsical properties, such as terminal strength, flexure strength, solfering
Resistance and solderability.
Noise suppression in digital



年程科技股份有限公司
桃园县杨梅镇高山里高狮路813巷22弄7号
电话: +886-3-4962286, +886-3-4788701
传真: +886-3-4962285, +886-3-4788702
http://www.tecstar.com.tw

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