年程科技股份有限公司


積層式晶片磁珠

Multilayer Chip Beads


High density packaging with a pitch of 2.54mm(0.1inch)max. Is possible. This series requires less space and has greater EMI suppression effects.
Excellent in phsical properties, such as terminal strength, flexure strength, solfering
Resistance and solderability.
Noise suppression in digital



年程科技股份有限公司
桃園縣楊梅鎮高山里高獅路813巷22弄7號
電話: (03)4962286, (03)4788701
傳真: (03)4962285, (03)4788702
http://www.tecstar.com.tw

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