Max Therm Thermal Interface Material 导热矽胶垫片
天迈导热矽胶软垫应用於填充电热元件,线路板和散热器, 金属罩以及金属底座之间的空隙。此材料独特的适应性能使他们能够复盖在不平整的表面上,在有限的空间内,将热量从单独的元件或整个线路板上传导出。
TennMax Thermally Conductive Silicone Rubber are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.