天邁企業股份有限公司



Max Therm Thermal Interface Material 導熱矽膠墊片


天邁導熱矽膠軟墊應用於填充電熱元件,線路板和散熱器, 金屬罩以及金屬底座之間的空隙。此材料獨特的適應性能使他們能夠複蓋在不平整的表面上,在有限的空間內,將熱量從單獨的元件或整個線路板上傳導出。

TennMax Thermally Conductive Silicone Rubber are used to fill air gaps between components or PC Board and heat sinks, metal enclosures and chassis. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces, transferring heat away from individual components or entire boards, and allowing where space is restricted.


天邁企業股份有限公司
台北縣汐止市康寧街169巷31-1號9樓之2
電話: (02)26954137
傳真: (02)26954138
http://www.tennmax.com.tw

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