咏翰科技股份有限公司
无铅助焊剂
无铅助焊剂#1133D-N
Fast drying; dull joint to reduce luster, No excess or lack of solder on joint; Non corrosive; excellent solderability and wettability; cleaning free result which meets various electrical characteristics requirements can be achieved within recommended operating parameters.

Practical Area-----Special formulated for high relative humidity ambient working environment, more suitable for high or low speed foaming or dipping soldering process.

无铅助焊剂
代表型号 1166D-N/1133D-N/LF-8000/LF-R978/LF-9000
具有快干、焊点消光且结构饱满、无腐蚀性、焊锡性卓越、润湿性极优且稳定安全。在标准比重下作业可达到完全免清洗之效果并可符合各电气性要求。
适用范围--是专门针对高湿气作业环境而设计的产品，较适合於发泡、沾浸、焊锡高速度或低速度作业。
咏翰科技股份有限公司
台北县板桥市双十路二段219号10楼
电话: +886-2-22506980, +886-2-22506991
传真: +886-2-22506990
http://www.unionsoltek.com
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