咏翰科技股份有限公司
锡膏SOLDER PASTE
锡膏SOLDER PASTE #G4-Ti450
Fewer reside left after reflow; No slump;minor corrosive;low solvent evaporation and very good SIR. G4-TI610series not merely possesses the advantages of MB series, but also carries the features of better snap off ability, solderability and printing ability;constant viscosity which is not changed with printing speed , pressure and time.
Practical Area-----Fine pitch capability(0.5mm/20mil) (0.4mm/16mil).
免清洗型焊锡膏
代表型号 G4-MB981系列 G4-TI610系列 G4-TI450系列
其回流焊后残留物极少，不易坍塌，腐蚀性小，溶剂挥发性慢及具有极高之表面绝缘阻抗性，G4-TI610系列锡膏除具有MB系列的优点外，更具助锡性佳，印刷性好，它能够改变脱膜性，粘度稳定，不会随著印刷的速度，压力，时间而改变。
适用范围--适合於手工迹印，细间距器件0.5mm/20mil或0.4 mm/16mil更细间距的贴装。
咏翰科技股份有限公司
台北县板桥市双十路二段219号10楼
电话: +886-2-22506980, +886-2-22506991
传真: +886-2-22506990
http://www.unionsoltek.com
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