咏翰科技股份有限公司
无铅锡膏PB-FREE SOLDER PASTE
无铅锡膏PB-FREE SOLDER PASTE
Excellent solderability and wettability; minor viscosity change during continuous printing process thus maintain a stable printable condition; good solderability can still maintain even high temperature.

Practical Area-----Applicable for convection oven reflow process;can be sued for fine pitch printing.

无铅锡膏
代表型号 LFS-5A-300/LF-5C-300/ULF-108-98系列
具有良好的焊锡性及充足的滋润性，连续印刷时，粘性变化极小，有稳定之印刷性；高温时，仍持有最佳的焊锡性。
适用范围--可用於热风式回焊及充氮回焊制程；可印刷细小的格式。
咏翰科技股份有限公司
台北县板桥市双十路二段219号10楼
电话: +886-2-22506980, +886-2-22506991
传真: +886-2-22506990
http://www.unionsoltek.com
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