無鉛錫膏PB-FREE SOLDER PASTE
Excellent solderability and wettability; minor viscosity change during continuous printing process thus maintain a stable printable condition; good solderability can still maintain even high temperature.
Practical Area-----Applicable for convection oven reflow process;can be sued for fine pitch printing.
無鉛錫膏
代表型號 LFS-5A-300/LF-5C-300/ULF-108-98系列
具有良好的焊錫性及充足的滋潤性,連續印刷時,粘性變化極小,有穩定之印刷性;高溫時,仍持有最佳的焊錫性。
適用範圍--可用於熱風式回焊及充氮回焊制程;可印刷細小的格式。