資騰科技股份有限公司

瑞士SYNOVA微水刀雷射切割機

Laser Dicing Equipment

高速, 低溫, 無毛邊切磋機

The Laser Dicing System is available with manual loading (LDS 200 M),
with cleaning station (LDS 200 C), and with cassette loading (LDS 200 A).

產品可應用於LCD, LED, Touch Panel, IC, Solar Cell 等高科技制程應用.

資騰科技股份有限公司
新竹市光復路二段二巷47號3F

電話: (02)23560688
傳真: (02)23581988

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