Address: 1F., No. 3, Industry East Road Iii, Science-Based Industrial Park, Hsin-Chu, Taiwan
Tel: +886-3-5631079
FAX: +886-3-5643371
Est. Year: 1998
Capital: NT$ 1,050,000,000
Board Chairman: John Hsann
General Manager: Horace Chung

Products:
gold bump, asolder bump, flip chip package wafer level chip scale package.