Address: No. 1-6, Lihsin 1 Rd., Science-Based Industrial Park, Hsinchu, Taiwan, R.O.C.
Tel: +886-3-5678788
FAX: +886-3-5008039
Est. Year: 1997
Capital: NT$ 1,200,000,000
Board Chairman: Chung-Hsin Lee
General Manager: Fei-Jain Wu

Products:
gold bump, solder bump, flip chip. TAB.