VIMIC ELECTRONIC CORPORATION
IC Packaging Industry
Dispensing Nozzle
Applied with Jet Dispensing fluid glue (such as Epoxy…etc.) in IC-package Die-Bonding process.
Application Equipment： Any brands of Auto Dispenser machines
Material：Nickel alloy + Stainless steel
Specification：
1. Standard types.
2. Customer-made for Customer’ needs.
VIMIC ELECTRONIC CORPORATION
5F-12, No. 210, Tai-Chung Industrial District 38 Rd., Tai-Chung City,Taiwan 407
Tel: +886-4-36002668
Fax: +886-4-36006866
http://www.vimic.com
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